[IEEE 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) - Vancouver, BC, Canada (2020.1.18-2020.1.22)] 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) - CMOS Compatible TSV Process with Post-CMOS Thermomigration Refilling of Au-Si Eutectic Alloy
Zhong, Peng, Pei, Binbin, Yu, Tingting, Dou, Chuanguo, Yang, Heng, Li, XinxinYear:
2020
DOI:
10.1109/mems46641.2020.9056293
File:
PDF, 3.94 MB
2020