Activation energy for Cu-Sn intermetallic in CNT-reinforced...

Soldering & Surface Mount Technology 2019 / 11 Vol. 32; Iss. 2

Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder

Mayappan, Ramani, Salleh, Amirah, Tokiran, Nurul Atiqah, Awang, N.A.
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Volume:
32
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-07-2019-0025
Date:
November, 2019
File:
PDF, 1.16 MB
2019
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