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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Analysis of Temperature Response Characteristics of Voltage RMS Sensor Packaging Based on Diode
Wang, Xiyou, Yang, Daoguo, Fan, Yasong, Li, WangyunYear:
2019
DOI:
10.1109/icept47577.2019.245123
File:
PDF, 2.83 MB
2019