[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of SnâZnâAg/6061Al joints in antenna module packages
Zhang, Ze-Jun, Zhou, Min-Bo, Sun, Tao, Wu, Xue, Zhang, Xin-PingYear:
2019
DOI:
10.1109/icept47577.2019.245317
File:
PDF, 3.19 MB
2019