[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Oxidation-resistant Cu-Ag Core-shell Nanoparticle Paste for High Temperature Electronic Packaging
Liu, Jiaxin, Mou, Yun, Peng, Yang, Chen, MingxiangYear:
2019
DOI:
10.1109/icept47577.2019.245804
File:
PDF, 2.28 MB
2019