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[IEEE 2020 43rd International Spring Seminar on Electronics Technology (ISSE) - Demanovska Valley, Slovakia (2020.5.14-2020.5.15)] 2020 43rd International Spring Seminar on Electronics Technology (ISSE) - Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
Hausler, Felix, Petillon, Simon, Dornheim, Johannes, Weser, Sascha, Eberhardt, Wolfgang, Zimmermann, Andre, Franke, JorgYear:
2020
DOI:
10.1109/isse49702.2020.9121136
File:
PDF, 240 KB
2020