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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors
Xu, Qianwen, Lee, Shi-Wei Ricky, Chi Chuen Lo, JefferyYear:
2019
DOI:
10.1109/ICEPT47577.2019.245271
File:
PDF, 3.19 MB
2019