[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Plasma treatment achieving enhanced thermal conductivity of a thermal interface material
Ma, Jiake, Wang, Yu, Gao, Ming, Ren, Linlin, Huang, Yifan, Sun, RongYear:
2019
DOI:
10.1109/icept47577.2019.246349
File:
PDF, 1.10 MB
2019