[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - A New Finding of Cu-Al IMC Corrosion and Investigation of Fluorine Contamination Influence on Cu-Al IMC Corrosion
Song, Meijiang, Mathew, Varughese, Li, Leo, Wang, Sonder, Han, M. C., Song, Yu, Descartin, Allen M.Year:
2019
DOI:
10.1109/ICEPT47577.2019.245230
File:
PDF, 1.57 MB
2019