Cross-layer dual modular redundancy hardened scheme of flip-flop design based on sense-amplifier
Huang, Zhengfeng, Su, Zian, Ni, Tianming, Xu, Qi, Qi, Haochen, Lu, Yingchun, Eric, Manzi, Xu, HuiJournal:
Journal of Circuits, Systems and Computers
DOI:
10.1142/S0218126621200036
Date:
July, 2020
File:
PDF, 649 KB
2020