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Effect of reinforced multiwall carbon nanotubes on the damping characteristics of Sn-Ag-Cu lead-free solder
Chang, Shih-Hang, Wu, Shyi-Kaan, Kuo, ChinVolume:
276
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2020.128196
Date:
October, 2020
File:
PDF, 1.18 MB
2020