Formation of a Diffusion Barrier-Like Intermetallic...

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JOM 2020 / 8

Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions

Yang, Ting-Li, Liu, Yu-chen, Yang, Chih-han, Kuo, Yi-kai, Lin, Shih-kang
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Journal:
JOM
DOI:
10.1007/s11837-020-04302-5
Date:
August, 2020
File:
PDF, 2.15 MB
2020
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