Electrical testing of small-series multi-chip microcircuit...

Electrical testing of small-series multi-chip microcircuit samples combining Wire Bond and Flip-Chip technologies

Kirienko, D A, Yu Ershova, N, Putrolaynen, V V, Lunkov, P V, Marcinkevich, K R
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Volume:
1515
Journal:
Journal of Physics: Conference Series
DOI:
10.1088/1742-6596/1515/2/022075
Date:
April, 2020
File:
PDF, 885 KB
2020
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