[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermal measurement and numerical analysis for automotive power modules
Sitta, Alessandro, Renna, Marco, Messina, Angelo Alberto, Sequenzia, Gaetano, D'Arrigo, Giuseppe, Calabretta, MicheleYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152204
File:
PDF, 105 KB
2020