[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermal cycling solder joint reliability reduction due to PCB bending introduced during product assembly
Wojcik, Marek, Duralek, JanuszYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152207
File:
PDF, 165 KB
2020