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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Identification of influencing PCB design parameters on thermal performance of a QFN package
Hollstein, Kai, Yang, Lintao, Gao, Yuan, Weide-Zaage, KirstenYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152651
File:
PDF, 644 KB
2020