[IEEE 2020 21st International Conference on Thermal,...

  • Main
  • [IEEE 2020 21st International...

[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - DSM Reballing Ball Height Prediction Model

Liu, Chao-Wei, Wu, Shang-Lin, Chen, Ming-Hung, Yeh, Chang-Lin, Pi, Tun-Ching, Kao, Jen-Chieh
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2020
DOI:
10.1109/EuroSimE48426.2020.9152667
File:
PDF, 1.30 MB
2020
Conversion to is in progress
Conversion to is failed