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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - DSM Reballing Ball Height Prediction Model
Liu, Chao-Wei, Wu, Shang-Lin, Chen, Ming-Hung, Yeh, Chang-Lin, Pi, Tun-Ching, Kao, Jen-ChiehYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152667
File:
PDF, 1.30 MB
2020