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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics
Schaal, Marco, Klingler, Markus, Metais, Benjamin, Gruninger, Ralph, Hoffmann, Stefan, Wunderle, BernhardYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152674
File:
PDF, 1.57 MB
2020