[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Impact of PCB-housing-interaction on QFN solder joint reliability
Vandevelde, Bart, Labie, Riet, Vanderstraeten, Daniel, Blansaer, EddyYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152724
File:
PDF, 481 KB
2020