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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder
Melinc, David, Magnien, Julien, Siroky, Georg, Kieslinger, Dietmar, Kozeschnik, ErnstYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152735
File:
PDF, 1.77 MB
2020