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Printed Circuit Board (PCB) Brazing and Ion Source Integration of a High-Field Asymmetric Ion Mobility Spectrometry (FAIMS) Chip
Du, Xiaoxia, Mou, Jiahao, Zeng, Hongda, Zeng, Ruosheng, Jiang, Yongrong, Li, HuaJournal:
Analytical Letters
DOI:
10.1080/00032719.2020.1803347
Date:
August, 2020
File:
PDF, 2.11 MB
2020