Influence of Thermal Aging on Lead-Free Solder Joints...

IOP Conference Series Materials Science and Engineering 2020 / 07 Vol. 864

Influence of Thermal Aging on Lead-Free Solder Joints Reliability: A Review

May Shin, Chang, Arif Anuar Mohd Salleh, Mohd, Suriyani Che Halin, Dewi
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Volume:
864
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/864/1/012183
Date:
July, 2020
File:
PDF, 249 KB
2020
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