Reliability of fine-pitch < 5 μm diameter microvias for high-density interconnects
Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.3013197
File:
PDF, 1.51 MB
2020