[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of Self-releasing adhesive tape as a temporary bonding material for 3D integration
Shiojima, Taro, Watanabe, Ryoichi, Hatai, Munehiro, Sugita, DaiheiYear:
2020
DOI:
10.1109/ECTC32862.2020.00025
File:
PDF, 872 KB
2020