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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Hybrid Fan-out Package for Vertical Heterogeneous Integration
Chuang, Po-Yao, Lin, M.-L., Hung, S.-T., Wu, Y.-W., Wong, D.-C., Yew, M.-C., Hsu, C.-K., Liao, L.-L, Lai, P.-Y., Tsai, P.-H., Chen, S.-M., Cheng, S.-K., Jeng, Shin-PuuYear:
2020
DOI:
10.1109/ECTC32862.2020.00061
File:
PDF, 392 KB
2020