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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel
Takahashi, Noriyuki, Susumago, Yuki, Lee, Sungho, Miwa, Yuki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, TakafumiYear:
2020
DOI:
10.1109/ECTC32862.2020.00132
File:
PDF, 611 KB
2020