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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Defect Localization in Through-Si-Interposer Based 2.5D ICs
Bhuvanendran Nair Gourikutty, Sajay, Meng Chow, Yew, Alton, Jesse, Bhimrao Umralkar, Ratan, Bai, Haonan, Keng Chua, Kok, Bhattacharya, SuryaYear:
2020
DOI:
10.1109/ECTC32862.2020.00189
File:
PDF, 1.07 MB
2020