Ultrahigh aspect ratio etching of silicon in SF...

Ultrahigh aspect ratio etching of silicon in SF 6 -O 2 plasma: The clear-oxidize-remove-etch (CORE) sequence and chromium mask

Nguyen, Vy Thi Hoang, Shkondin, Evgeniy, Jensen, Flemming, Hübner, Jörg, Leussink, Pele, Jansen, Henri
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Volume:
38
Journal:
Journal of Vacuum Science & Technology A
DOI:
10.1116/6.0000357
Date:
September, 2020
File:
PDF, 3.67 MB
2020
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