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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Trench Isolation Technology for Cost-effective Wafer-level 3D Integration with One-step TSV
Kawano, Masaya, Wang, Xiang-Yu, Ren, QinYear:
2020
DOI:
10.1109/ECTC32862.2020.00186
File:
PDF, 2.57 MB
2020