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Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless CuâCu bonding
Gao, Runhua, He, Siliang, Li, Jiahui, Shen, Yu-An, Nishikawa, HiroshiJournal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-020-04026-x
Date:
August, 2020
File:
PDF, 2.58 MB
2020