[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Flexible Fan-Out Wafer Level Packaging of Ultra-Thin Dies
Souriau, Jean-Charles, Castagne, Laetitia, Ladner, Carine, Franiatte, Remi, Guillaume, JenniferYear:
2020
DOI:
10.1109/ECTC32862.2020.00019
File:
PDF, 881 KB
2020