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Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites
Zhang, Dong-Li, Liu, Sheng-Nan, Cai, Hui-Wu, Feng, Qi-Kun, Zhong, Shao-Long, Zha, Jun-Wei, Dang, Zhi-MinVolume:
6
Journal:
Journal of Materiomics
DOI:
10.1016/j.jmat.2020.06.013
Date:
December, 2020
File:
PDF, 2.69 MB
2020