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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Effective Thermal Solution via Wafer Level Packaging Materials
Kim, Junghwa, Na, Wool-Chul, Kim, JungSeob, Im, Sumi, Lee, Dong-Hwan, Lim, Sanghak, Kim, Sang-KyunYear:
2020
DOI:
10.1109/ECTC32862.2020.00313
File:
PDF, 487 KB
2020