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Thermal and electrical performance investigation of FinFET with encased air-gap gate sidewalls from spacer encapsulation layer material and structure parameter perspectives
Huang, Ning, Liu, Weijing, Li, Qinghua, Bai, Wei, Tang, Xiadong, Yang, TingVolume:
103
Journal:
Microelectronics Journal
DOI:
10.1016/j.mejo.2020.104846
Date:
September, 2020
File:
PDF, 4.00 MB
2020