Vacuum-assisted selective adhesive imprinting for photonic...

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Vacuum-assisted selective adhesive imprinting for photonic packaging of complex MOEMS devices. Assembly of miniaturized particle sensor

Pribosek, Jaka, Zauner, Markus, Bardong, Jochen, Binder, Alfred, Maierhofer, Paul, Bergmann, Alexander, Rohrer, Georg
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Year:
2020
Journal:
IEEE Sensors Journal
DOI:
10.1109/JSEN.2020.3011216
File:
PDF, 786 KB
2020
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