[IEEE 2020 Symposium on Design, Test, Integration &...

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[IEEE 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Lyon, France (2020.6.15-2020.6.26)] 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Developing Self-powered High Performance Sensors: Part II - Preliminary Study On PE-ME Coupling In A Vibration Energy Convertor

Zheng, Luwei, Wang, Dong F., Fu, Yupeng, Yang, Xu, Suzuki, Yuji, Ryutaro, Maeda
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Year:
2020
DOI:
10.1109/DTIP51112.2020.9139142
File:
PDF, 332 KB
2020
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