[IEEE 2020 Symposium on Design, Test, Integration &...

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[IEEE 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Lyon, France (2020.6.15-2020.6.26)] 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - High Speed Silicon Wet Bulk Micromachining of Si{111} in KOH Based Solution

Rao, Avvaru Venkata Narasimha, Pal, Prem, Pandey, Ashok Kumar, Menon, P Krishna, Tanaka, Hiroshi, Sato, Kazuo
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Year:
2020
DOI:
10.1109/DTIP51112.2020.9139140
File:
PDF, 219 KB
2020
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