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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
Gim, MinHo, Kim, ChoongHoe, Na, SeokHo, Ryu, DongSu, Park, KyungRok, Kim, JinYoungYear:
2020
DOI:
10.1109/ECTC32862.2020.00166
File:
PDF, 997 KB
2020