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Polylithic Integration of 2.5-D and 3-D Chiplets Enabled by Multi-Height and Fine-Pitch CMIs
Jo, Paul K., Rajan, Sreejith K., Gonzalez, Joe L., Bakir, Muhannad S.Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.3011325
File:
PDF, 3.17 MB
2020