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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Finite Element Modeling Methodology for Monotonic Bend Test of Flip-Chip BGA Package
McCann, Scott, Lee, Tom, Ramalingam, SureshYear:
2020
DOI:
10.1109/ECTC32862.2020.00323
File:
PDF, 711 KB
2020