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Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
Shen, Yu-An, Lin, Chun-Ming, Li, Jiahui, He, Siliang, Nishikawa, HiroshiVolume:
10
Journal:
Scientific Reports
DOI:
10.1038/s41598-020-67126-y
Date:
December, 2020
File:
PDF, 625 KB
2020