[IEEE 2020 Symposium on Design, Test, Integration &...

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[IEEE 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Lyon, France (2020.6.15-2020.6.26)] 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Long-range Planar Conveyance Device Based On A Digital Electromagnetic Actuator Array

Tisnes, S. Duque, Shi, Z., Herth, E., Edmond, S., Petit, L., Martincic, E., Prelle, C., Terrien, J., Moulin, J., Lefeuvre, E., Lamarque, F.
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Year:
2020
DOI:
10.1109/DTIP51112.2020.9139157
File:
PDF, 380 KB
2020
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