Microstructure and mechanical property of Cu/In–45Cu/Ni...

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Journal of Materials Research 2020 / 08

Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding

Yang, Li, Zhou, Shiyuan, Zhang, Yaocheng, Xiong, Yifeng, Jiang, Wei, Shen, Sai
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Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2020.194
Date:
August, 2020
File:
PDF, 1.41 MB
2020
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