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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding
Kim, Soon-Wook, Fodor, Ferenc, Heylen, Nancy, Iacovo, Serena, De Vos, Joeri, Miller, Andy, Beyer, Gerald, Beyne, EricYear:
2020
DOI:
10.1109/ECTC32862.2020.00046
File:
PDF, 1.39 MB
2020