[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Thermo compression bonding for large dies under protective atmosphere
Abdilla, Jonathan, Bayer, Uwe, Boomsma, Ruurd, Bulacher, Stephan, Kalss, Alexander, Martin, Stephan, Meixner, Harald, Moura, Thiago, Selhofer, Hubert, Voegele, Wolfgang, Widauer, MartinYear:
2020
DOI:
10.1109/ECTC32862.2020.00202
File:
PDF, 2.08 MB
2020