[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - High-speed ultra-accurate direct C2W bonding
Brandstatter, Birgit, Aschenwald, Daniel, Auer, Benedikt, Bilewicz, Norbert, Boomsma, Ruurd, Kroll, Christoph, Mayr, Andreas, Neumayr, Richard, Rieser, Hannes, Schernthaner, Mario, Selhofer, Hubert, SYear:
2020
DOI:
10.1109/ECTC32862.2020.00303
File:
PDF, 947 KB
2020