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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Mechanical characterization and modeling of different pad structures
Calabretta, Michele, Guarnera, Daniele, Sitta, Alessandro, Renna, Marco, Sciuto, Antonella, D'Arrigo, Giuseppe, Oliveri, Salvatore Massimo, Sequenzia, GaetanoYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152799
File:
PDF, 269 KB
2020