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Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition
Inami, Kota, Matsuda, Tomoki, Kawabata, Rei, Sano, Tomokazu, Hirose, AkioJournal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-020-04205-w
Date:
August, 2020
File:
PDF, 1.82 MB
2020