[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics
Liu, Fuhan, Zhang, Rui, DeProspo, Bartlet H., Dwarakanath, Shreya, Nimbalkar, Pratik, Ravichandran, Siddharth, Weyers, David, Kathaperumal, Mohanalingam, Tummala, Rao R., Swaminathan, MadhavanYear:
2020
DOI:
10.1109/ECTC32862.2020.00182
File:
PDF, 1.18 MB
2020