Highly Selective Polishing Rate Between a Tungsten Film and...

Highly Selective Polishing Rate Between a Tungsten Film and a Silicon-Dioxide Film by Using a Malic-Acid Selectivity Agent in Tungsten-Film Chemical-Mechanical Planarization

Seo, Eun-Bin, Park, Jea-Gun, Bae, Jae-Young, Park, Jin-Hyung
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Volume:
76
Journal:
Journal of the Korean Physical Society
DOI:
10.3938/jkps.76.1127
Date:
June, 2020
File:
PDF, 647 KB
2020
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